SMT Industry Abbreviations

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A
AC-DC
 AC to DC Converter
AMF 
 Auto Mount Feedback
AOI 
 Automated Optical Inspection
AOQL 
 Acceptable Outgoing Quality Limit
AOQ 
 Average Outgoing Quality
APQP 
 Advanced Product Quality Planning
ATE 
 Automated Test Equipment
AXI 
 Automatic X-ray Inspection
B
BGA 
 Ball Grid Array
BIST 
 Built-In Self-Test
BJT 
 Bipolar Junction Transistor
BLDC 
 Brushless DC Motor
BOM 
 Bill of Materials
C
CAD 
 Computer-Aided Design
CAGR 
 Compound Annual Growth Rate
CAM 
 Computer-Aided Manufacturing
CCCV 
 Constant Current Constant Voltage
CDIP 
 Ceramic Dual Inline Package
CEMF 
 Counter ElectroMotive Force
CEM 
 Ceramic Electrolytic Capacitor
CEM 
 Contract Electronics Manufacturer
CNC 
 Computer Numerical Control
COB 
 Chip on Board
CPH 
 Components Per Hour
CSP 
 Chip Scale Package
Cpk 
 Process Capability Index
D
DAP 
 Days After Payment
DC 
 Direct Current
DFM 
 Design for Manufacturability
DFN/QFN 
 Dual/Quad Flat No-leads
DFN 
 Dual Flat No-leads
DFT 
 Design for Test
DFx 
 Design for Excellence
DIP 
 Dual In-line Package
DMAIC 
 Define, Measure, Analyze, Improve, Control
DOE 
 Design of Experiments
DPMO 
 Defects Per Million Opportunities
DRAM 
 Dynamic Random Access Memory
DRC 
 Design Rule Check
DSP 
 Digital Signal Processor
E
ECO 
 Engineering Change Order
EDA 
 Electronic Design Automation
EEPROM 
 Electrically Erasable Programmable Read-Only Memory
EIA 
 Electronic Industries Alliance
EMC 
 Electromagnetic Compatibility
EMI 
 Electromagnetic Interference
EMS 
 Electronic Manufacturing Services
EMT 
 Electronic Manufacturing Technology
ENIG 
 Electroless Nickel Immersion Gold
ERP 
 Enterprise Resource Planning
ESD 
 Electrostatic Discharge
F
FCT 
 Functional Circuit Test
FIFO 
 First In, First Out
FMEA 
 Failure Mode and Effects Analysis
FOV 
 Field of View
FPGA 
 Field Programmable Gate Array
G
GPD 
 Good Production Day
Gerber 
 Standard format for PCB design data
H
HALT 
 Highly Accelerated Life Test
HAL 
 Hot Air Leveling
HASL 
 Hot Air Solder Leveling
HDIS 
High-Density Interconnection System
HMI 
 Human Machine Interface
HMT 
 Hole Mounting Technology
HVM 
 High Volume Manufacturing
HV 
 High Voltage
I
ICT 
In-Circuit Test
IC 
 Integrated Circuit
IGBT 
 Insulated Gate Bipolar Transistor
IPC-A-610
 Acceptability of Electronic Assemblies Standard
IPC-J-STD-1
 Requirements for Soldered Electrical and Electronic Assemblies Standard
IPCA-610
 Rework, Modification and Repair of Electronic Assemblies Standard
IPC 
 Association Connecting Electronics Industries
ISO 
 International Organization for Standardization
J
JEDEC 
 Joint Electron Device Engineering Council
JFET 
 Junction Field-Effect Transistor
JTAG 
 Joint Test Action Group
K
KPI 
 Key Performance Indicator
L
LCC 
 Leadless Chip Carrier
LCD 
 Liquid Crystal Display
LCR 
 Inductor-Capacitor-Resistor
LDO 
 Low Dropout Voltage Regulator
LED 
 Light Emitting Diode
LF 
 Lead-Free
LGA 
 Land Grid Array
M
MCU 
 Microcontroller Unit
MELF 
 Metal Electrode Leadless Face
MES 
 Manufacturing Execution System
MLCC 
 Multilayer Ceramic Capacitor
MOSFET 
 Metal Oxide Semiconductor Field-Effect Transistor
MOV 
 Metal Oxide Varistor
MRB 
 Material Review Board
MRP 
 Material Requirements Planning
MSL 
 Moisture Sensitivity Level
MTBF 
 Mean Time Between Failures
MTTR 
 Mean Time To Repair
N
NDA 
Non-Disclosure Agreement
NIST 
 National Institute of Standards and Technology
NPI 
 New Product Introduction
NRE 
 Non-Recurring Engineering
NTC 
 Negative Temperature Coefficient thermistor
O
OEE 
 Overall Equipment Effectiveness
OEM 
 Original Equipment Manufacturer
OLED 
 Organic Light Emitting Diode
OSP 
 Organic Solderability Preservative
Op-amp
 Operational Amplifier
P
PADS 
 Personal Automated Design System
PCBA 
 Printed Circuit Board Assembly
PCB 
 Printed Circuit Board
PDIP 
 Plastic Dual Inline Package
PEC 
 Process Engineering Change
PEEC 
 Process Engineering Evaluation Change
PEEC 
 Process Engineering Evaluation Change
PLCC 
 Plastic Leaded Chip Carrier
PLC 
 Programmable Logic Controller
PLM 
 Product Lifecycle Management
PMSM 
 Permanent Magnet Synchronous Motor
PNP 
 Pick and Place
PPM 
 Parts Per Million
PTC 
 Positive Temperature Coefficient thermistor
PTH 
 Pin Through Hole
PWB 
 Printed Wiring Board
Q
QA 
 Quality Assurance
QFN 
 Quad Flat No-Lead
QFP 
 Quad Flat Package
QMS 
 Quality Management System
QVGA 
 Quarter Video Graphics Array
R
R&D 
 Research and Development
RAM 
 Random Access Memory
RF 
 Radio Frequency
RMA 
 Returned Materials Authorization
ROI 
 Return on Investment
ROM 
 Read-Only Memory
RoHS 
 Restriction of Hazardous Substances
S
S&R 
 Scrap and Rework
SAC 
 Silver Alloy Copper
SBC 
 Single Board Computer
SBE 
 Solder Ball Extrusion
SBU 
 Strategic Business Unit
SCADA 
 Supervisory Control and Data Acquisition
SCL 
 Serial Clock
SDRAM 
 Synchronous Dynamic Random Access Memory
SFC 
 Shop Floor Control
SFF 
 Small Form Factor
SIA 
 Semiconductor Industry Association
SIP 
 Single In-line Package
SMA 
 Surface Mount Assembly
SMC 
 Surface Mount Chip
SMD 
 Surface Mount Device
SMEMA 
 Surface Mount Equipment Manufacturers Association
SME 
 Surface Mount Equipment
SMOBC 
 Solder Mask Over Bare Copper
SMOGB 
 Solder Mask Over Gold Body
SMPS 
 Switched Mode Power Supply
SMP 
 Surface Mount Packages
SMTA 
 Surface Mount Technology Association
SMT 
 Surface-Mount Technology
SN 
 Serial Number
SOD 
 Small Outline Diode
SOIC 
 Small Outline Integrated Circuit
SOJ 
 Small Outline J-Leaded
SON 
 Small Outline No-leads
SOP 
 Standard Operating Procedure
SOT 
 Small Outline Transistor
SPC 
 Statistical Process Control
SPI 
 Solder Paste Inspection
SRAM 
 Static Random Access Memory
SSOP 
 Shrink Small Outline Package
STB 
 Surface Tension Bonding
SWD 
 Serial Wire Debug
T
T&M 
 Test and Measurement
TAE 
 Tantalum Electrolytic Capacitor
TFT 
 Thin Film Transistor
THT 
 Through-Hole Technology
TNC 
 Tin-Nickel-Copper
TO 
 Transistor Outline
TPM 
 Total Productive Maintenance
TPV 
 Third Party Verification
TQFP 
 Thin Quad Flat Package
TQM 
 Total Quality Management
TSOP 
 Thin Small Outline Package
TSOT 
 Thin Small Outline Transistor
TSSOP 
 Thin Shrink Small Outline Package
TVS 
 Transient Voltage Suppressor
U
UART 
 Universal Asynchronous Receiver Transmitter
UPH 
 Units Per Hour
UPS 
 Uninterruptible Power Supply
USB 
 Universal Serial Bus
UV 
 Ultraviolet
V
VCO 
 Voltage Controlled Oscillator
VFD 
 Vacuum Fluorescent Display
VGA 
 Video Graphics Array
VIA 
 Vertical Interconnect Access
VLSI 
 Very Large Scale Integration
VSS 
 Voltage Supply Source
W
WIP 
 Work In Progress
WLED 
 White Light Emitting Diode
X
X-Ray
X-Ray Inspection
X-Y
XY-axis
XRF 
 X-Ray Fluorescence
Y
Z
Z-axis
 Height or Depth Axis
ZIF 
 Zero Insertion Force